The Library
Improved analog performance of strained Si n-MOSFETs on thin SiGe strained relaxed buffers
Tools
Alatise, Olayiwola M., Kwa, Kelvin S. K., Olsen, Sarah H. and O'Neill, Anthony G. (2008) Improved analog performance of strained Si n-MOSFETs on thin SiGe strained relaxed buffers. In: 38th European Solid State Device Research Conference (ESSDERC), Edinburgh International Conference Centre, Edinburgh, United Kingdom, Sep 15-19, 2008. Published in: Proceedings of the 38th European Solid-State Device Research Conference (ESSDERC 2008) pp. 99-102. doi:10.1109/ESSDERC.2008.4681708 ISSN 1930-8876.
Research output not available from this repository.
Request-a-Copy directly from author or use local Library Get it For Me service.
Official URL: http://dx.doi.org/10.1109/ESSDERC.2008.4681708
Abstract
Strained Si/SiGe devices offer a route to high speed digital devices. Analog design trade-offs can also be improved using strained Si if device self-heating can be controlled; strained Si is generated using a strain relaxed buffer (SRB) of SiGe which has a lower thermal conductivity compared with bulk Si. In this work the impact of the SiGe SRB thickness on the analog performance of strained Si nMOSFETs is investigated. The negative drain conductance caused by self heating at high power levels leads to negative self gain and anomalous circuit behavior in terms of nonlinear phase shifts. By using ac and dc measurements we show that by reducing the SRB thickness self-heating effects are significantly lower and the analog design space is improved. The range of gate voltages that leverage positive self gain in 100 nm strained Si MOSFETs fabricated on 425 nm SiGe SRBs is increased by 100% compared with strained Si devices fabricated on conventional SRBs 4 mum thick. Guidelines for the maximum SRB thicknesses required to obtain positive self gain for highly scaled technology generations where self-heating effects increase are presented. For a 22 nm technology node, the SRB thickness should not exceed 20 nm for 1.5 V drain voltage and gate overdrive. The thin SRB is grown using a C-layer and does not compromise any aspect of device performance.
Item Type: | Conference Item (Paper) | ||||
---|---|---|---|---|---|
Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering | ||||
Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||
Journal or Publication Title: | Proceedings of the 38th European Solid-State Device Research Conference (ESSDERC 2008) | ||||
Publisher: | IEEE | ||||
ISSN: | 1930-8876 | ||||
Book Title: | ESSDERC 2008 - 38th European Solid-State Device Research Conference | ||||
Official Date: | 2008 | ||||
Dates: |
|
||||
Page Range: | pp. 99-102 | ||||
DOI: | 10.1109/ESSDERC.2008.4681708 | ||||
Status: | Not Peer Reviewed | ||||
Publication Status: | Published | ||||
Access rights to Published version: | Restricted or Subscription Access | ||||
Conference Paper Type: | Paper | ||||
Title of Event: | 38th European Solid State Device Research Conference (ESSDERC) | ||||
Type of Event: | Conference | ||||
Location of Event: | Edinburgh International Conference Centre, Edinburgh, United Kingdom | ||||
Date(s) of Event: | Sep 15-19, 2008 |
Data sourced from Thomson Reuters' Web of Knowledge
Request changes or add full text files to a record
Repository staff actions (login required)
View Item |