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Numerical and experimental simulation of electro-thermal behavior of VLSI chips
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Delalic, J., Cohen, R., Chen, J., Silage, D., Lin, J., Kaku, V., Modi, D. and Moussaoui, C. (2001) Numerical and experimental simulation of electro-thermal behavior of VLSI chips. In: 34th International Symposium on Microelectronics (IMAPS), Baltimore, USA, 9-11 Oct 2001. Published in: Proceedings of the Society of Photo-Optical Instrumentation Engineers pp. 218-223.
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Item Type: | Conference Item (Paper) | ||||
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > WMG (Formerly the Warwick Manufacturing Group) | ||||
Journal or Publication Title: | Proceedings of the Society of Photo-Optical Instrumentation Engineers | ||||
Publisher: | SPIE | ||||
Official Date: | 2001 | ||||
Dates: |
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Page Range: | pp. 218-223 | ||||
Status: | Peer Reviewed | ||||
Publication Status: | Published | ||||
Conference Paper Type: | Paper | ||||
Title of Event: | 34th International Symposium on Microelectronics (IMAPS) | ||||
Type of Event: | Other | ||||
Location of Event: | Baltimore, USA | ||||
Date(s) of Event: | 9-11 Oct 2001 | ||||
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