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Correlation analysis of surface topography and its mechanical properties
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UNSPECIFIED (2004) Correlation analysis of surface topography and its mechanical properties. In: 3rd International Symposium on Instrumentation Science and Technology, Xian, PEOPLES R CHINA, AUG 18-22, 2004. Published in: PROCEEDINGS OF THE THIRD INTERNATIONAL SYMPOSIUM ON INSTRUMENTATION SCIENCE AND TECHNOLOGY, VOL 3 pp. 246-254. ISBN 7-5603-2056-2.
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Abstract
This paper presents an investigation on the correlation between surface functions measured by a novel multi-function tribological probe microscope (TPM) at the micro/nanometre level. Four surface functions of topography, friction, nano-hardness and Young's modulus are measured over a range of materials, on a point-by-point basis, by using the TPM. The capability of multi-function mapping of the TPM allows the cross correlation to be carried out, in order to investigate the influence of one function to another, especially the surface topography's effect on its mechanical properties. A general negative correlation between surface topography and hardness/Young's modulus has been found for most homogeneous surfaces, which indicates the modulation effect of surface geometrical features on its mechanical properties.
Item Type: | Conference Item (UNSPECIFIED) | ||||
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Subjects: | T Technology > TL Motor vehicles. Aeronautics. Astronautics R Medicine T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QC Physics |
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Journal or Publication Title: | PROCEEDINGS OF THE THIRD INTERNATIONAL SYMPOSIUM ON INSTRUMENTATION SCIENCE AND TECHNOLOGY, VOL 3 | ||||
Publisher: | HARBIN INSTITUTE TECHNOLOGY PUBLISHERS | ||||
ISBN: | 7-5603-2056-2 | ||||
Editor: | Tan, J and Wen, X | ||||
Official Date: | 2004 | ||||
Dates: |
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Number of Pages: | 9 | ||||
Page Range: | pp. 246-254 | ||||
Publication Status: | Published | ||||
Title of Event: | 3rd International Symposium on Instrumentation Science and Technology | ||||
Location of Event: | Xian, PEOPLES R CHINA | ||||
Date(s) of Event: | AUG 18-22, 2004 |
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