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Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics
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Rajaguru, P., Lu, H., Bailey, C., Ortiz Gonzalez, Jose Angel and Alatise, Olayiwola M. (2015) Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics. In: Thermal Investigations of ICs and Systems (THERMINIC), 2015 21st International Workshop on, Paris, France, 30 Sept - 2 Oct 2015. Published in: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) pp. 1-6. doi:10.1109/THERMINIC.2015.7389607
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Official URL: http://dx.doi.org/10.1109/THERMINIC.2015.7389607
Abstract
This paper details a finite element modelling approach of the press pack assembly process for a diode in a power electronic module. Molybdenum and aluminum graphite have been investigated as suitable materials for the contact pad. Contact analysis has been used to model the pressurized thermal interface in order to extract both the stress and temperature distribution in the diode. Average temperature and von Mises stress on the chip for a combination of clamping pressure, load current and contact pad material have been extracted from the modeling results. At present, based on the assumptions and modeling parameters used, Aluminum Graphite seems to have better performance in comparison with molybdenum in terms of generating a lower average chip temperature. Additionally optimum clamping pressure has been estimated by performing a numerical optimisation analysis in order to minimise both the average temperature and stress in the chip.
Item Type: | Conference Item (Lecture) | ||||
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Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering | ||||
Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||
Journal or Publication Title: | 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) | ||||
Publisher: | IEEE | ||||
Official Date: | 2015 | ||||
Dates: |
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Page Range: | pp. 1-6 | ||||
DOI: | 10.1109/THERMINIC.2015.7389607 | ||||
Status: | Peer Reviewed | ||||
Publication Status: | Published | ||||
Access rights to Published version: | Restricted or Subscription Access | ||||
Conference Paper Type: | Lecture | ||||
Title of Event: | Thermal Investigations of ICs and Systems (THERMINIC), 2015 21st International Workshop on | ||||
Type of Event: | Conference | ||||
Location of Event: | Paris, France | ||||
Date(s) of Event: | 30 Sept - 2 Oct 2015 |
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