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Measurements of thermal expansion coefficients of anodized aluminium substrates for hybrid circuits
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Manning, A. S. and Liu, Xianping (1999) Measurements of thermal expansion coefficients of anodized aluminium substrates for hybrid circuits. Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials Design and Applications, 213 (2). pp. 121-127. doi:10.1177/146442079921300205 ISSN 1464-4207.
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Official URL: http://dx.doi.org/10.1177/146442079921300205
Abstract
High-power substrates for hybrid circuits that combine aluminium with an anodic coating are highly efficient as the heat generated from chips mounted on the coated substrates can be dissipated rapidly. However, due to the difference between the thermal expansion coefficients of the two materials, a large thermal tensile stress can be built up during heating of the substrate, which causes cracking in the coating and subsequently the loss of electrical integrity. In this investigation a simple method of measuring the thermal expansion coefficient for an anodic substrate is described. Measurements were taken from an aluminium/coating composite and the thermal expansion coefficient of the coating was determined using the principles of elementary mechanics.
Item Type: | Journal Article | ||||
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Subjects: | Q Science > Q Science (General) T Technology > T Technology (General) |
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||
Journal or Publication Title: | Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials Design and Applications | ||||
Publisher: | Sage Publications Ltd. | ||||
ISSN: | 1464-4207 | ||||
Official Date: | April 1999 | ||||
Dates: |
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Volume: | 213 | ||||
Number: | 2 | ||||
Page Range: | pp. 121-127 | ||||
DOI: | 10.1177/146442079921300205 | ||||
Status: | Peer Reviewed | ||||
Publication Status: | Published | ||||
Access rights to Published version: | Restricted or Subscription Access |
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