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Thermal coupling analysis for a multi-chip paralleled IGBT module in a doubly fed wind turbine power converter
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Li, Hui, Liao, Xinglin, Zeng, Zheng, Hu, Yaogang, Li, Yang, Liu, Shengquan and Ran, Li (2017) Thermal coupling analysis for a multi-chip paralleled IGBT module in a doubly fed wind turbine power converter. IEEE Transactions on Energy Conversion, 32 (1). pp. 80-90. doi:10.1109/TEC.2016.2614526 ISSN 0885-8969.
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WRAP_1170207-engineering-061016-huili_ran_ieee_t-ec_2016.pdf - Accepted Version - Requires a PDF viewer. Download (1287Kb) |
Official URL: http://dx.doi.org/10.1109/TEC.2016.2614526
Abstract
Thermal coupling between adjacent IGBT or diode chips is the result of non-uniform temperature distribution in a multi-chip IGBT module. This affects the junction temperatures and hence the total power loss predicted for the module. The study first investigates the impact of thermal coupling effect on the junction temperatures through finite element method (FEM), and then develops a thermal coupling impedance model to represent such effect. The effect is shown to reduce with the distance exponentially. The model result agrees well with test. The validated model is then used to predict the junction temperature swings during operational power cycling in a DFIG wind turbine, showing the difference between the rotor and grid side converters. The model presented and the results obtained may be important for reliability evaluation and condition monitoring in the wind turbine power converters as well as in other multi-chip paralleled power electronic systems.
Item Type: | Journal Article | ||||||||
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Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering | ||||||||
Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||||||
Library of Congress Subject Headings (LCSH): | Insulated gate bipolar transistors, Diodes, Electric current converters, Wind turbines | ||||||||
Journal or Publication Title: | IEEE Transactions on Energy Conversion | ||||||||
Publisher: | IEEE | ||||||||
ISSN: | 0885-8969 | ||||||||
Official Date: | March 2017 | ||||||||
Dates: |
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Volume: | 32 | ||||||||
Number: | 1 | ||||||||
Page Range: | pp. 80-90 | ||||||||
DOI: | 10.1109/TEC.2016.2614526 | ||||||||
Status: | Peer Reviewed | ||||||||
Publication Status: | Published | ||||||||
Access rights to Published version: | Restricted or Subscription Access | ||||||||
Date of first compliant deposit: | 10 October 2016 | ||||||||
Date of first compliant Open Access: | 10 October 2016 | ||||||||
Funder: | Guo jia zi ran ke xue ji jin wei yuan hui (China) [National Natural Science Foundation of China] (NSFC), China. Guo jia ke xue ji shu bu [Ministry of Science and Technology] (CMST), China. Fundamental Research Funds for the Central Universities (FRFCU), Graduate Scientific Research and Innovation Foundation of Chongqing, Integration and Demonstration Program of Chongqing, China | ||||||||
Grant number: | 51377184, 51675354 (NSFC), 973 Program 2012CB215205 (CMST), 106112016CDJZR158802 (FRFCU), CYB16020 (Research and Innovation Foundation of Chongqing), CSTC2013JCSF70003 (Demonstration Program of Chongqing) |
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