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Analysis of moisture transport between connected enclosures under a forced thermal gradient
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Staliulionis, Z., Joshy, S., Ambat, R., Jabbari, M., Mohanty, S. and Hattel, J. H. (2016) Analysis of moisture transport between connected enclosures under a forced thermal gradient. In: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Singapore, 30 Nov - 3 Dec 2016 pp. 320-324. ISBN 9781509043699. doi:10.1109/EPTC.2016.7861497
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Official URL: http://dx.doi.org/10.1109/EPTC.2016.7861497
Abstract
Nowadays, many electronic products are exposed to harsh climatic conditions, and hence the protection of these devices is a crucial factor in design of systems. The presence of moisture and its condensation inside electronic enclosures during application can significantly alter the performance of the electronic products [1]–[5]. As a consequence, the life span of these products will reduce during operation. Electronic components are often put together with other heating/cooling components in a larger system, e.g. having a cooling pump adjacent to a cavity full of PCBAs. In such cases, a temperature gradient will be created between a warm region-heated by electronics-and a cold region-cooled by the pump. Studying the moisture transport under the abovementioned forced condition, and developing tools for capturing the mass reduction and/or moisture condensation in each region accordingly is of great interest.
Item Type: | Conference Item (Paper) | ||||
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > WMG (Formerly the Warwick Manufacturing Group) | ||||
ISBN: | 9781509043699 | ||||
Book Title: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) | ||||
Official Date: | 2016 | ||||
Dates: |
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Page Range: | pp. 320-324 | ||||
DOI: | 10.1109/EPTC.2016.7861497 | ||||
Status: | Peer Reviewed | ||||
Publication Status: | Published | ||||
Access rights to Published version: | Restricted or Subscription Access | ||||
Conference Paper Type: | Paper | ||||
Title of Event: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) | ||||
Type of Event: | Conference | ||||
Location of Event: | Singapore | ||||
Date(s) of Event: | 30 Nov - 3 Dec 2016 |
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