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Molecular dynamics simulation of atomic diffusion in friction stir spot welded Al to Cu joints

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Mypati, Omkar, Pavan Kumar, Polkampally, Iqbal, Perwej, Pal, Surjya Kanta and Srirangam, Prakash (2021) Molecular dynamics simulation of atomic diffusion in friction stir spot welded Al to Cu joints. Mechanics of Advanced Materials and Structures . pp. 1-7. doi:10.1080/15376494.2021.1972188

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WRAP-Molecular-dynamics-simulation-atomic-diffusion-friction-stir-spot-welded-Al-Cu-2021.pdf - Accepted Version
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Official URL: https://doi.org/10.1080/15376494.2021.1972188

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Abstract

Dissimilar metals joining, especially Aluminum (Al) to copper (Cu), have gained importance in batteries for electric vehicles. Although friction stir spot welding (FSSW) has recently been used for welding dissimilar materials, progress has been very slow toward understanding the effect of temperature on diffusion condition between the two materials with the same FCC crystal structure. The thermo-mechanical modeling has been used to define the trajectory of Al and Cu particles at the weld interface, but it had a limitation to quantified the diffusion coefficient. Hence, the molecular dynamics (MD) study has been used to investigate the atomic interdiffusion of Al and Cu. The transmission electron microscopy results are used to validate the MD simulation outcome to understand the formation of dislocations and intermetallic compounds. The MD results implicated the formation of γ-phase (BCC), i.e., Al4Cu9 IMC toward the Cu side. Further, the In-situ investigation of non-FCC phase formation at FSSW condition has also been studied.

Item Type: Journal Article
Subjects: Q Science > QH Natural history
T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TN Mining engineering. Metallurgy
T Technology > TS Manufactures
Divisions: Faculty of Science > WMG (Formerly the Warwick Manufacturing Group)
SWORD Depositor: Library Publications Router
Library of Congress Subject Headings (LCSH): Aluminum-copper alloys, Aluminum -- Welding , Joints (Engineering), Aluminum-copper alloys -- Effect of temperature on , Aluminum -- Thermal properties -- Simulation methods, Copper -- Thermal properties -- Simulation methods, Transmission electron microscopy , Aluminum -- Diffusion, Copper -- Diffusion
Journal or Publication Title: Mechanics of Advanced Materials and Structures
Publisher: Informa UK Limited
ISSN: 1537-6532
Official Date: 24 September 2021
Dates:
DateEvent
24 September 2021Published
19 August 2021Accepted
Page Range: pp. 1-7
DOI: 10.1080/15376494.2021.1972188
Status: Peer Reviewed
Publication Status: Published
Publisher Statement: “This is an Accepted Manuscript of an article published by Taylor & Francis in Mechanics of Advanced Materials and Structures on 24/09/2021, available online: http://www.tandfonline.com/10.1080/15376494.2021.1972188
Access rights to Published version: Restricted or Subscription Access

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