Number of items: 1.
2023
Singh, Bhanu Pratap, Li, Shirong, Choudhury, Khaled Redwan, Norrga, Staffan and Nee, Hans-Peter
(2023)
Analyzing the impact of die positions inside the power module on the reliability of solder layers for different power cycling scenarios.
In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 16-19 Apr 2023. Published in: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
ISBN 9798350345971.
doi:10.1109/eurosime56861.2023.10100764
ISSN 2833-8596.
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