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Analyzing the impact of die positions inside the power module on the reliability of solder layers for different power cycling scenarios
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Singh, Bhanu Pratap, Li, Shirong, Choudhury, Khaled Redwan, Norrga, Staffan and Nee, Hans-Peter (2023) Analyzing the impact of die positions inside the power module on the reliability of solder layers for different power cycling scenarios. In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 16-19 Apr 2023. Published in: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ISBN 9798350345971. doi:10.1109/eurosime56861.2023.10100764 ISSN 2833-8596.
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Official URL: https://doi.org/10.1109/EuroSimE56861.2023.1010076...
Abstract
Solder layers, used as bonding material inside the power module to attach the semiconductor die on Direct Bond Copper (DBC) substrate and DBC substrate on baseplate, are one of the regions most prone to failure. The failure usually occurs in the form of solder cracks and depends on various operating conditions, such as- maximum temperature, temperature swing, and heating time. The cracks generated inside the solder layers can eventually result in its delamination. Power modules are usually power cycled to estimate the failure sites and mechanisms. However, the failure mechanisms can vary depending on the frequency, amplitude, and range of the temperature in the Power Cycling Tests (PCT). In this study, we have used the Finite Element Method (FEM) in COMSOL Multiphysics to analyse the impact of the PCT on both die attach, and baseplate attach solder layers. Additionally, the effect of the degree of asymmetry in the die position on the reliability of both the solder layers are analysed. The FEA (Finite Element Analysis) results are analysed to have a better understanding about the aspects impacting the lifetime of the power module.
Item Type: | Conference Item (Paper) | ||||||
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Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering T Technology > TL Motor vehicles. Aeronautics. Astronautics |
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||||
SWORD Depositor: | Library Publications Router | ||||||
Library of Congress Subject Headings (LCSH): | Electric vehicles -- Power supply, Power semiconductors -- Design and construction, Solder and soldering, Silicon carbide -- Electric properties, Silicon carbide -- Thermal properties | ||||||
Journal or Publication Title: | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | ||||||
Publisher: | IEEE | ||||||
ISBN: | 9798350345971 | ||||||
ISSN: | 2833-8596 | ||||||
Official Date: | 17 April 2023 | ||||||
Dates: |
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DOI: | 10.1109/eurosime56861.2023.10100764 | ||||||
Status: | Peer Reviewed | ||||||
Publication Status: | Published | ||||||
Reuse Statement (publisher, data, author rights): | © 2023 Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | ||||||
Access rights to Published version: | Restricted or Subscription Access | ||||||
Date of first compliant deposit: | 20 June 2023 | ||||||
Date of first compliant Open Access: | 20 June 2023 | ||||||
Conference Paper Type: | Paper | ||||||
Title of Event: | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | ||||||
Type of Event: | Conference | ||||||
Location of Event: | Graz, Austria | ||||||
Date(s) of Event: | 16-19 Apr 2023 |
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