Number of items: 5.
Journal Article
Yang, Jianxiong, Che, Yanbo, Ran, Li, Hu, Borong and Du, Mingxing
(2022)
Junction temperature estimation approach based on TSEPs in multichip IGBT modules.
Journal of Power Electronics, 22
.
pp. 1596-1605.
doi:10.1007/s43236-022-00465-3
ISSN 1598-2092.
Hu, Zedong, Hu, Borong, Ran, Li, Tavner, Peter, Kong, Hua, Mawby, Philip A. and Wu, Ruizhu
(2022)
Monitoring power module solder degradation from heat dissipation in two opposite directions.
IEEE Transactions on Power Electronics, 37
(8).
pp. 9754-9766.
doi:10.1109/TPEL.2022.3157464
ISSN 0885-8993.
Hu, Borong, Ortiz Gonzalez, Jose Angel, Ran, Li, Ren, Hai, Zeng, Zheng, Lai, Wei, Gao, Bing, Alatise, Olayiwola M., Lu, Hua, Bailey, Christopher and Mawby, P. A. (Philip A.)
(2017)
Failure and reliability analysis of a SiC power module based on stress comparison to a Si device.
IEEE Transactions on Device and Materials Reliability, 17
(4).
pp. 727-737.
doi:10.1109/TDMR.2017.2766692
ISSN 1530-4388.
Conference Item
Hu, Borong, Konaklieva, Sylvia, Ran, Li, Kourra, Nadia, Williams, Mark A., Lai, Wei and Mawby, Philip. A.
(2018)
Long term reliability of power modules with low amplitude thermomechanical stresses and initial defects.
In: 2018 IEEE Energy Conversion Congress and Exposition (ECCE), Portland, OR, USA, 23 - 27 Sep 2018. Published in: 2018 IEEE Energy Conversion Congress and Exposition (ECCE)
ISBN 9781479973125.
doi:10.1109/ECCE.2018.8558137
Thesis
Hu, Borong
(2021)
Uneven degradation and condition monitoring of multi-chip power modules for wind turbines.
PhD thesis, University of Warwick.
This list was generated on Thu May 2 03:26:20 2024 BST.